Phase Change Memory, Phase Change Memory Assembly, Phase Change Memory Cell, 2D Phase Change Memory Cell Array, 3D Phase Change Memory Cell Array and Electronic Component

ABSTRACT

A phase change memory having a memory material layer consisting of a phase change material, and a first and second electrical contact which are located at a distance from one another and via which a switching zone of the memory material layer can be traversed by a current signal, wherein the current signal can be used to induce a reversible phase change between a crystalline phase and an amorphous phase and thus a change in resistance of the phase change material in the switching zone. The invention also relates to a phase change memory assembly, a phase change memory cell, a 2D phase change memory cell array, a 3D phase change memory cell array and an electronic component.

CROSS REFERENCE TO RELATED APPLICATIONS

This is the U.S. national phase of International Application No.PCT/EP04/11812, filed Oct. 19, 2004 which claims priority to GermanApplication No. 103 49 750.1, filed Oct. 23, 2003.

BACKGROUND OF THE INVENTION

The invention relates to a phase change memory comprising a memorymaterial layer consisting of a phase change material, and a first andsecond electrical contact which are located at a distance from oneanother and via which a switching zone of the memory material layer canbe traversed by a current signal, wherein the current signal can be usedto induce a reversible phase change between a crystalline phase and anamorphous phase and thus a change in resistance of the phase changematerial in the switching zone. The invention also relates to a phasechange memory assembly, a phase change memory cell, a 2D phase changememory cell array, a 3D phase change memory cell array and an electroniccomponent.

One of the essential basics of modern information technologies consistsin non-volatile memories. In all data processing, data transmission and“consumer electronics” devices (digital cameras, video cameras, mobiletelephones, computers, etc.), non-volatile memories are required inorder to provide buffer storage of information, or in order to keepimportant information available for boot operations when the device isswitched on. At present, the main electronic non-volatile memory is theso-called FLASH memory. Future non-volatile memories could be providedby magnetic memories (MRAM) or ferroelectric memories (FRAM) or inparticular phase change memories (Phase-Change RAM/PC-RAM/PRAM/OvonicUnified Memory-OUM).

The latter form the subject matter of this application. Phase changememories comprise a memory material layer consisting of a phase changematerial, and a first and second electrical contact which are located ata distance from one another. Via the electrical contacts, a switchingzone of the memory material layer can be traversed by a current signal,which carries for example a pulsed switching current. The current signalcan be used to thermally induce a reversible phase change between acrystalline phase and an amorphous phase and thus a change in resistanceof the phase change material in the switching zone. In the case of adynamic range for the change in resistance of up to three orders ofmagnitude, this is used for bit or multi-bit information storage in aphase change memory. The physical principle of a phase change memorywill be explained in more detail in the detailed description relating toFIG. 1.

Phase change memories have been known in principle since the 1960s, andare described for example in the article “Reversible ElectricalSwitching Phenomena in Disordered Structures” by Ovshinsky in PhysicalReview Letters, Vol. 21, pages 1450-1453. The state of currenttechnology can be found in the articles “OUM—A 180 nm Non-volatileMemory Cell Element Technology for Stand Alone and EmbeddedApplications” by Lai and Lowrey in IEEE 2001, pages 36.5.1 to 36.5.4 and“Nonvolatile, High Density, High Performance Phase-Change Memory” byTyson, Wicker, Lowrey, Hudgens and Hunt in IEEE 2000, pages 385 to 390.

Current information technology means that a convergence can be expectedbetween the fields of cost-effective bulk memories (e.g. hard disks andoptical data memories) and fast electric memories (e.g. FLASH),resulting in so-called “Unified Memories” (PC-RAM) which combinecost-effective production with rapid random addressing in order tooperate in both market sectors with a single technology. The ease ofimplementation and the potential of phase change memories asnon-volatile memories in this scenario depends primarily on the degreeto which a plurality of phase change memories can be highly integrated.To this end, it must be possible for a phase change memory to beswitched by means of the smallest possible switching currents of acurrent signal, since a phase change memory could otherwise not beoperated by future highly integrated CMOS control transistors.

The present concept of a phase change memory is described in detail inU.S. Pat. No. 5,933,365. This concept is based on a vertical currentflow between two electrical contacts of the phase change memory whichare arranged one above the other. That is to say, the current of acurrent signal for switching a phase change memory of the type mentionedabove is conducted perpendicularly to the lateral extension of the phasechange memory, that is to say perpendicularly to thedeposition/lithography plane of the phase change memory, between twoelectrical layer contacts which are arranged one above the other in thevertical extension. According to the conventional view, this “vertical”structure of a phase change memory is the preferred structure in orderto be able to integrate as many cells as possible in a phase changememory array by way of row/column (X/Y) addressing. One example of athree-dimensional (3D) phase change memory array is described in U.S.Pat. No. 6,525,953 B1.

One problem is that the phase change between a crystalline phase and anamorphous phase in the phase change material is induced thermally via acurrent pulse of the current signal, e.g. using a temperature rangebetween room temperature and 600° C. The current signal is fed into thephase change memory via the electrical contacts, which are usually madeof metal, such that a switching zone of a memory material layer istraversed by the current signal. Since electrical conductors are usuallyalso good heat conductors, this means in the conventional concepts of aphase change memory that a high energy loss occurs between the thermallyinfluenced switching zone and the electrical contact, which in turnmakes it necessary to increase the switching currents of the currentsignal.

However, small control transistors, which are necessary for any memoryelement that can be highly integrated, usually do not supply enoughcurrent to switch a conventional phase change memory having a verticalstructure. The solution favoured in U.S. Pat. No. 5,933,365 thereforeconsists in the use of a so-called “heater”, that is to say a “heater”layer is applied in each case between an electrical contact and thememory material layer within the context of the vertical structure, saidheater layer being made of a material which is less of a conductor ofcurrent and heat than the electrical contact itself. The “heater”therefore has a thermally insulating effect between the memory materiallayer and the electrical contact. In this way, the switching zone of thephase change memory can be heated more efficiently, and as a result canbe switched by lower switching currents. This means that a phase changebetween a crystalline phase and an amorphous phase and thus a change inresistance of the phase change material in the switching zone can beinduced by lower switching currents of a current signal.

However, the effect of the “heater” layer provided in U.S. Pat. No.5,933,365 within the context of the vertical structure of the phasechange memory is limited and does not reduce the switching currentrequirement for a current signal to an extent such that a sufficientlyhigh level of integration can be achieved. Moreover, the structure of aphase change memory becomes increasingly complicated on account of the“heater” layers.

SUMMARY OF THE INVENTION

The object of the present invention is to provide a phase change memoryand components built thereon, wherein the switching current of a currentsignal and the heat loss via the electrical contacts of the phase changememory are kept as low as possible and at the same time the structuraldesign of a phase change memory is kept as simple as possible.

This object is achieved by the invention by means of a phase changememory of the type mentioned in the introduction, in which according tothe invention the switching zone is located along a lateral extension ofthe phase change memory between the first and second electricalcontacts, wherein current conduction of the current signal through theswitching zone takes place along the lateral extension.

The structural design of the present phase change memory is thereforesuch that, in the switching mode, the switching current of the currentsignal flows through the switching zone laterally, that is to sayparallel to the lithography/deposition plane. Current conduction of thecurrent signal through the switching zone therefore takes place alongthe lateral extension.

The switching zone, that is to say the zone within the memory materiallayer within which the current signal is used to induce a phase changebetween a crystalline phase and an amorphous phase and thus a change inelectrical resistance of the phase change material, is therefore locatedin a region between the first and second electrical contacts in whichcurrent conduction of the current signal is oriented along the lateralextension, so that the switching zone is therefore arranged along thelateral extension.

The lateral current conduction of the present phase change memory thusforms the basis of a completely novel concept of a “lateral” structureof a phase change memory, which differs fundamentally from theconventional approaches of a “vertical” structure as disclosed forexample in U.S. Pat. No. 5,933,365. This is because preference wouldusually be given to current conduction of the current signal along avertical extension of a conventional phase change memory, that is to sayperpendicularly to the lateral extension, between two electricalcontacts arranged one above the other in the vertical direction. Such a“vertical” structure would also usually in principle be preferred as anadd-on to the CMOS standard, since it allows a space-saving and compactstructure so that usually a high integration density could be achievedwith a vertical structure.

By contrast, the present invention has found that, in order to achieve ahigh integration density for a phase change memory, preference should begiven to a “lateral” structure or a “lateral” concept, that is to saycurrent conduction of the current signal running in the switching zonealong the lateral extension, and a corresponding structure of the phasechange memory. This is because, in a phase change memory, in addition toa compact structure, the current consumption of the phase change memoryis also a parameter which significantly limits the integration density.The current consumption is determined by the switching current of thecurrent signal. The lower the current consumption of a phase changememory, the higher the latter can be integrated, since the switchingcurrents switched by the transistors can be smaller and thus so too canthe transistors themselves.

It should be noted that a surface area which is traversed by current ina phase change memory having a vertical structure lies in thelithography/deposition plane. Only the lithography size F (minimumfeature size) has an effect on the surface area which is traversed bycurrent in a phase change memory having a vertical structure, and thuson the switching current of the current signal, so that at least atraversed surface area of F² and an accordingly high current must beassumed.

With the present lateral structure of the phase change memory, this isfundamentally different. In the present case, the surface area which istraversed by current is formed perpendicularly to the lateral extension.When the current of the current signal is conducted through theswitching zone along the lateral extension, the minimum feature size Fmerely has a linear effect on the traversed surface area. The surfacearea which is traversed by current in a phase change memory having thelateral structure is additionally determined only by the thickness D ofthe memory material layer in the switching zone. The surface area whichis traversed by current, and thus the switching current of the signal,is thus defined only in a linear manner by the minimum feature size F onthe one hand and the layer thickness D of the memory material layer inthe switching zone on the other hand, that is to say by FxD. Therequired switching current of the current signal is accordingly low.

Meanwhile, layer thicknesses D can be technologically controlled andprocessed considerably below 3 nm and moreover extremely accurately, toatomic precision, that is to say approximately in the region of 0.5 nm.Accordingly, the minimum feature size F must be reduced in a much morecomplicated manner. Present high-technology memories use minimum featuresizes F in the region of 130 nm, and minimum feature sizes F in theregion of 45 nm will be desired in future. This is opposed by a layerthickness size D in the region of 10-20 nm, advantageously below 10 nm,in particular below 5 nm, which can readily be achieved in technologicalterms. In the present phase change memory having a lateral structure,the surface area of the switching zone which is traversed by current andthus the switching zone itself can thus be reduced considerably comparedto a phase change memory having a vertical structure. The surface areawhich is traversed by current in a lateral structure of a phase changememory, that is to say the traversing surface area, formedperpendicularly to the lateral extension, for the current conduction inthe switching zone is considerably reduced compared to a phase changememory having a vertical structure. The present phase change memoryaccording to the lateral structure will therefore be more energy-saving,highly integratable and scalable than conventional phase changememories.

The phase change material is advantageously a chalcogenide material,that is to say a chalcogenide alloy, i.e. an alloy based on thematerials of the chalcogenides (main group VI of the periodic table),and can in principle be processed by means of standard processes such asion milling, reactive ion etching or a plasma etching process. Moreover,it has presently been acknowledged that a chalcogenide material of thememory material layer of the present phase change memory can bedeposited in a particularly advantageous manner within the context of asputtering process.

Whereas in the case of conventional phase change memories having avertical structure the electrical current transport and the dissipationof heat away from the switching zone have the same (vertical) direction,in the case of the present phase change memory according to the lateralconcept the flow of heat runs mainly in the vertical direction while theelectrical switching current of the current signal runs in the lateraldirection. Optimization of the current conduction of the current signalwithin the context of electrical current transport has a direct effecton the current consumption of the phase change memory. Optimization ofthe thermal conversion of the switching current of the current signal inthe switching zone has an effect on the current consumption and theability to be rewritten and/or the speed of a phase change memory. Thesetwo essential optimization parameters—electrical current consumption anddissipation of heat—are therefore optimized independently andautonomously of one another in the present phase change memory accordingto the lateral concept. A further reduction in the switching currentsand an improvement in the general performance of the present phasechange memory can thus be achieved.

According to the invention, it is also provided that the switching zoneis located at a narrowing between the first and second electricalcontacts in the memory material layer, wherein a size of the narrowingis smaller than a size of the memory material layer at the first orsecond electrical contact. Here, the location of the switching zonebetween the first and second electrical contacts is essentially definedby the location of the narrowing. In particular, the switching zone isformed by the narrowing between the first and second contacts in thememory material layer. The size of the narrowing may be the size of atraversing surface area, formed perpendicularly to the lateralextension, for the current conduction in the switching zone. The smallerthe narrowing of the memory material layer in the switching zone, thesmaller the switching current of the switching signal that is requiredfor the thermally induced phase change and thus the change in resistanceof the phase change material in the switching zone. The significantadvantage of the phase change memory proposed here is the fact that, onaccount of the lateral structure, the narrowing is also determined bythe thickness D of the memory material layer, which in technologicalterms can be processed without any problems far below 20 nm,advantageously below 10 nm or 5 nm. In the lateral extension of thephase change memory, the narrowing is also determined by the minimumfeature size F. At present, F can easily lie in the region of 130 nm. Infuture, sizes in the region of 45 nm or below will be desired for F.“Moore's Law” applies here, that is to say halving of F also leads tohalving of D.

Advantageous further developments of the invention can be found in thedependent claims and provide in detail advantageous possibilities forthe further development of the proposed phase change memory within thecontext of the lateral structure and concept with regard to currentminimization while at the same time having a simple structural designand also concerning further advantages.

It has proven to be particularly advantageous that a traversing surfacearea, formed perpendicularly to the lateral extension, for the currentconduction in the switching zone is narrowed in relation to a traversingsurface area for the current conduction at the first or secondelectrical contact, wherein the ratio of the traversing surface areas,that is to say the surface contrast, advantageously lies between 1:2 and1:100. Such a strong focussing of the current in a correspondingly smallswitching zone defined by the narrowing can advantageously be readilyachieved according to the lateral structure and concept of the phasechange memory proposed here. This leads to a considerable currentreduction and thus to a possible integration density which would not bepossible with a vertical structure of a phase change memory as customaryto date.

The narrowing may be formed in the lateral and/or vertical extension ofthe phase change memory. In particular, it proves to be advantageous ifa size of the narrowing in the lateral extension is smaller than a sizeof the memory material layer in the lateral extension at the first orsecond electrical contact. A double-cone-shaped or H-shaped structurehas proven particularly suitable here.

Advantageously, it is also possible for a size of the narrowing in thevertical extension to be smaller than a size of the memory materiallayer in the vertical extension at the first or second electricalcontact. This may be effect by reducing the layer thickness of thememory material layer in any way in a region between the first andsecond electrical contacts, and this region then essentially forms theswitching zone.

According to the abovementioned further developments of the invention,the switching zone is therefore advantageously formed by a restrictionor narrowing of the lateral and/or vertical extension of the memorymaterial layer, that is to say is formed and located in the phase changematerial itself. The highest current density thus occurs in theswitching zone and thereby thermally induces, within a volume of theswitching zone that is defined in terms of orders of magnitude by theminimum feature size F and the layer thickness D, the phase changebetween the crystalline phase and the amorphous phase and thus thechange in resistance of the phase change material within the memorymaterial layer.

This leads to a further particularly preferred further development ofthe invention, in which the first and/or second electrical contactsdirectly adjoin the memory material layer and the switching zone isformed in the memory material layer at a distance from the first and/orsecond contact.

Since the narrowing which defines the switching zone is located in thephase change material of the memory material layer itself and at thesame time is located at a distance from the electrical contacts applieddirectly to the memory material layer, the phase change materialsurrounding the switching zone in the memory material layer thereforehas a heat-insulating effect between the switching zone and theelectrical contacts. On account of the lateral concept and structure ofthe present phase change memory, the high temperatures and the rapidtemperature changes of the switching zone can be kept far away from thecontact materials of the electrical contacts.

The thermal distance between the switching zone and the electricalcontacts is therefore on the one hand selected to be large enough thatthe switching zone and the electrical contacts are practically decoupledin thermal terms. This has the advantage that the transport of energyaway from the switching zone to the electrical contact is practicallyruled out, and this leads to efficient use of the switching current ofthe current signal with regard to the thermal phase transformation inthe switching zone since the latter can heat up more efficiently to thephase change temperature. Furthermore, the high temperatures of theswitching zone are kept far away from the contact materials of theelectrical contacts, so that atomic interdiffusion of the contactmaterials is prevented. As a result, the electrical contacts have aparticularly long service life, even though they are applied directly tothe memory material layer.

On the other hand, the thermal distance between the switching zone andthe electrical contacts is selected to be small enough that, in thenormal state, the best possible current conductivity between theelectrical contacts is achieved. It has been found that the thermaldistance between the switching zone and one of the electrical contactslies particularly advantageously between 20 and 50 nm. This ensures asufficiently great temperature reduction between the switching zone andthe electrical contacts and at the same time allows sufficient currentconductivity.

By virtue of the particularly preferred further development of theinvention described here, it is therefore possible for customary contactmaterials of the semiconductor industry to be used, wherein the proposedphase change memory permits improved long-term stability andparticularly simple process control during production. Complicatedcontact layer systems which have been customary to date for screening orinsulating the electrical contacts from the switching zone usingso-called “heater” layers or diffusion barriers (usually composed ofTiWNi and graphite) are thus avoided.

In the abovementioned further developments of the invention, it has beenfound that the switching zone can be traversed by the current signalalong the lateral extension particularly when the switching zone islocated between the electrical contacts in such a way that at least athermal distance of the switching zone from each of the electricalcontacts can be kept within the range from 20 to 50 nm. A switching zoneis located between electrical contacts along a lateral extensionparticularly when the current conduction in the switching zone, oroptionally beyond, at least 20 nm, advantageously 40 nm, takes placeessentially parallel to the lithography/deposition plane.

Accordingly, a switching zone need not necessarily be located on adirect connecting line between a first and second electrical contact,but rather it is sufficient if the switching zone is located in a regionwhich lies along the lateral extension between a first and secondelectrical contact. In this case, the first and second electricalcontacts are advantageously located in such a way that currentconduction of the current signal through the switching zone can takeplace in a particularly simple manner along the lateral extension.According to one preferred further development of the invention, thedistance between the first and second electrical contact is orientedessentially along the lateral extension. In this case, a connecting linebetween the electrical contacts should run essentially parallel to thelithography/deposition plane and if possible should deviate from thisplane by no more than 45°. Specifically, the arrangement of theelectrical contacts can be selected in a manner depending on the designof the phase change memory.

It proves to be particularly advantageous for many applications if thedistance between the first and second electrical contact is orientedalong the lateral extension, wherein the first electrical contact islocated below the memory material layer and the second electricalcontact is located above the memory material layer. In order to preventcurrent conduction of the current signal through the switching zonealong the vertical extension, the first electrical contact and thesecond electrical contact are in any case not arranged along a verticalextension of the phase change memory. The arrangement of an electricalcontact below the memory material layer has the advantage that thecontacting of the phase change memory can take place on the substrateside.

For other applications, the distance between the first and secondelectrical contact is advantageously oriented along the lateralextension, wherein the first and the second electrical contacts arelocated above the memory material layer.

In particular, an arrangement of the switching zone in a region betweenthe first and second electrical contact and below the first and/orsecond electrical contact along the lateral extension proves to beadvantageous.

Yet another particularly preferred further development of the inventionconsists in that a core forming zone directly adjoins the memorymaterial layer. This is because it has been found that, during theswitching operation in the switching zone, the crystallization of theamorphized material is the slower process in comparison with theamorphization. This may last up to 200 ns. For the crystallization,firstly cores form and then these grow until the switching zone islargely crystallized. A core forming zone which directly adjoins thememory material layer, and preferably directly adjoins the switchingzone, in any case shortens the core formation and makes it possible inthe present further development of the invention to shorten theswitching time in any case to 20 ns.

Preferably, the core forming zone is designed in the form of a layer.The core forming material may be a nitride-based material. A coreforming zone is preferably processed by briefly exposing the processingsurface to an N₂ process atmosphere during the deposition of the memorymaterial layer, i.e. the chalcogenide layer for example. A core formingzone which extends along the lateral extension can be implemented withparticular advantage within the context of the lateral concept of aphase change memory proposed here. By contrast, this would not bepossible in the context of a vertical structure, since a nitride layerhas electrically insulating properties and in any case inhibits verticalcurrent conduction.

Advantageously, in the proposed phase change memory, the first andsecond electrical contacts and the memory material layer form part of aMESA structure which is applied to a substrate, wherein the memorymaterial layer is insulated from a heat sink by a thermal barrier. Acore forming layer, in particular based on nitride, may advantageouslybe arranged between the memory material layer and the thermal barrier.The thermal barrier is advantageously a layer based on ZnS:SiO₂. Thephase change material is advantageously a chalcogenide material, e.g. aGeSbTe-based material. The heat sink may be formed by the substratematerial, in particular a Si substrate. In this case, the heat sinkwould be located below the phase change memory. A metal layer can alsobe used as heat sink, said metal layer being arranged above or below thephase change memory.

In one variant, the invention also relates to a phase change memoryassembly comprising one or more phase change memories according to anyof the preceding further developments, wherein in each case one of theelectrical contacts of each phase change memory lies at the sameelectrical potential as a respective one of the electrical contacts ofthe other phase change memories. That is to say that in each case onecontact of each phase change memory may for example be at ground. Inthis way, a wide range of different arrangements can be implemented, asexplained by way of example in the detailed description.

For another refinement of a phase change memory or a phase change memoryassembly according to one of the abovementioned further developments, aphase change memory may also have one or more further electricalcontacts in addition to the first and second electrical contacts,depending on requirements.

The invention also relates to a phase change memory cell comprising aphase change memory according to any of the aforementioned furtherdevelopments of the invention and/or a phase change memory assembly,wherein a selection unit with a non-linear current/voltagecharacteristic is provided. On account of its non-linear current/voltagecharacteristic, the selection unit is provided for actuating the phasechange memory, e.g. within the context of an array. The selection unitmay in particular be a diode or a transistor. For an X/Y addressing forexample in an array of such phase change memory cells, all cells of arow are addressed via one addressing contact and all the cells of acolumn are addressed via a further addressing contact. Only the cellwhich is addressed by a certain row and a certain column at the sametime is actually addressed, since, due to the non-linear current/voltagecharacteristic, an addressing signal (e.g. a voltage) lies above athreshold signal only for the addressed cell.

In principle, a selection unit can be arranged external to the phasechange memory. However, it proves to be particularly advantageous if aselection unit is integrated in the phase change memory itself and/or inthe phase change memory assembly itself. In particular, a selection unitcan be located between the memory material layer and the firstelectrical contact and/or between the memory material layer and thesecond electrical contact. This is explained in detail in FIGS. 8 and 9of the detailed description. Such a further development of the inventionmakes it superfluous to process a selection unit external to the phasechange memory. Rather, the latter can advantageously be integrated inthe structure of the phase change memory. For this type of furtherdevelopment of the invention, a phase change memory in which the firstelectrical contact is located below the memory material layer proves tobe particularly suitable. The arrangement of a diode as selection unitbetween the memory material layer and the first contact located belowthe memory material layer is particularly suitable for a two-dimensional(2D) phase change memory cell array. The arrangement of a diode asselection unit between the memory material layer and the second contactlocated above the memory material layer is particularly suitable for athree-dimensional (3D) phase change memory cell array.

The invention also relates to a two-dimensional (2D) phase change memorycell array in which a number of two-dimensionally connected andindividually addressable phase change memory cells according to any ofthe preceding further developments are arranged.

Within the context of a three-dimensional (3D) phase change memory cellarray, a number of memory layers in the form of 2D phase change memorycell arrays according to any of the preceding further developments ofthe invention are arranged one above the other.

It proves to be particularly advantageous if respective phase changememories and/or cells which are arranged directly above one another arecontacted by way of a common via. Contacting by way of a common via canbe implemented in a particularly advantageous manner within the contextof the present lateral concept and structure of a phase change memory,whereas each column and row of each phase change memory cell array inall memory layers of the 3D array has to be contacted individuallywithin the context of a vertical structure of a conventional phasechange memory, as in U.S. Pat. No. 6,525,953 B1. By contrast, in thepresent (3D) phase change memory cell array comprising phase changememories according to the lateral concept and structure, each column androw only has to be contacted once for all memory layers together.

According to one further development of the 3D phase change memory cellarray according to the lateral concept and structure, in order toaddress a selected phase change memory of a 2D phase change memory cellarray, respective phase change memory cells which are arranged directlyabove one another can be switched to a first potential by way of thecommon via, and in the process all the other phase change memory cellsof any other 2D phase change memory cell array can be switched to asecond potential. This type of switching proves to be particularlyadvantageous for the three-dimensional addressing of the present 3Dphase change memory cell array. For the purposes of the row/column (X/Y)addressing for the planes, all the phase change memory cells along aZ-direction can be placed at a fixed potential, as first potential, byway of the common via and in this way an X/Y selection is made. TheZ-addressing takes place here by placing all the phase change memorycells in the selected 2D phase change memory cell array at a freepotential, as the second potential, for example at ground. The rest ofthe 2D phase change memory cell arrays are in a “floating state/highimpedance state”.

The invention also relates to an electronic component with an integratedmemory function and/or logic function, comprising a phase change memoryand/or a phase change memory assembly and/or a phase change memory celland/or a phase change memory cell array according to any of theabovementioned further developments of the invention. This may inparticular be an Application-Specific Integrated Circuit (ASIC) with anintegrated memory function and/or logic function. Such electroniccomponents are used in particular in data processing, data transmissionand “consumer electronics” devices such as mobile telephones, computersand video cameras and/or digital cameras.

Examples of embodiments of the invention will now be described belowwith reference to the drawing. The latter is intended to show theexamples of embodiments, not necessarily to scale; rather, the drawingis given in a schematic and/or slightly distorted form where this isdeemed useful for explanation purposes. In respect of supplementarydetails concerning the teaching which can be taken directly from thedrawing, reference is made to the relevant prior art. It should be notedhere that many modifications and changes in respect of the form anddetails of an embodiment can be made without departing from the generalconcept of the invention. The features of the invention which aredisclosed in the description, the drawing and the claims may beessential to the invention both individually and in any combination. Thegeneral concept of the invention is not limited to the exact form ordetails of the preferred embodiment described and shown below, nor is itlimited to a subject matter which may be restricted in comparison withthe subject matter claimed in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a resistance/temperature graph illustrating the phase changebetween a crystalline phase and an amorphous phase and thus a change inresistance of the phase change material in the switching zone(Widerstand=Resistance, Temperatur=Temperature).

FIG. 2 is a schematic structure of a phase change memory, in which theswitching zone is located along a lateral extension of the phase changememory between the first and second electrical contacts, wherein currentconduction of the current signal through the switching zone takes placealong the lateral extension.

FIG. 3 is a preferred first embodiment of the proposed phase changememory, in which the first electrical contact is located below thememory material layer and the second electrical contact is located abovethe memory material layer.

FIG. 4 is a second preferred embodiment of the proposed phase changememory, in which the first and second electrical contacts are locatedabove the memory material layer.

FIG. 5 is a first schematically shown processing sequence for a furtherpreferred embodiment of the proposed phase change memory.

FIG. 6 is a second schematically shown processing sequence for yetanother preferred embodiment of the proposed phase change memory.

FIG. 7 is a preferred embodiment of a phase change memory assembly, inwhich in each case one of the electrical contacts of each phase changememory lies at the same electrical potential as a respective one of theelectrical contacts of the other phase change memories.

FIG. 8 is a schematically shown particularly preferred embodiment of aphase change memory cell on a CMOS control transistor with equivalentcircuit diagram.

FIG. 9 is a modified, schematically shown particularly preferredembodiment of a phase change memory cell, in which a diode is integratedas selection unit in the phase change memory.

FIG. 10 is an equivalent circuit diagram for a particularly preferredembodiment of a 2D phase change memory cell array (Reihe=Row).

FIG. 11 is a schematic diagram of a particularly preferred embodiment ofa 3D phase change memory cell array with equivalent circuit diagram.

FIG. 12 is a schematically shown electronic module.

DETAILED DESCRIPTION

Embodiments of the invention will be described with reference to theaccompanying drawing figures wherein like numbers represent likeelements throughout.

FIG. 1 shows a resistance/temperature graph 1 recorded at a heating rateof 23° C. per minute, which illustrates in principle the phase changebetween a crystalline phase 3 and an amorphous phase 5 and thus a changein resistance 7 of a phase change material in a switching zone of amemory material layer of a phase change memory. The change in resistance7 is thermally induced in a phase change memory by means of a currentsignal via a change in temperature 9. A preferred chalcogenide phasechange material may be both in a stable crystalline phase 3 and in ameta-stable amorphous phase 5 at room temperature. The reversible phasetransformation within the context of an amorphization or crystallizationbetween the two phases 5, 3 is accompanied by a significant change inelectrical resistance 7 and thus is used to store a digital informationitem. A phase change material advantageously exhibits an extremely largedynamic range of a change in resistance 7, which may comprise more thanthree orders of magnitude. This has the advantage that, for example,multi-bit storage in a phase change memory cell is also possible. Onaccount of the material, a phase change memory cell can also be read atlow currents without destroying the stored information items(non-destructive readout). In addition, in the present lateral conceptand structure of a phase change memory, it is also possible, dependingon the current supply, to implement a phase transition in just part ofthe switching zone or the entire switching zone, so that a multiplelogic can thus be implemented depending on the current supply. This maytake place in such a way that, for example, a first, relatively smallpart of the switching zone undergoes phase transformation at a first,low current and a second, larger part of the switching zone undergoesphase transformation at a second, higher current.

Besides the lower production costs of the lateral concept presented herecompared to the vertical concept, the integration property in particularproves to be much better than in other concepts, that is to say infuture higher integration densities with increasingly low currentconsumption will be able to be implemented due to the lower switchingcurrent requirement of the phase change memory in the lateral conceptpresented here.

The graph of FIG. 1 shows a sequence of quasi-static states, so that thedynamic phase transformation processes of a crystallization 13 and anamorphization 11 can anyhow be shown in principle. In each case, theprocesses are illustrated here by corresponding arrow directions. Thecrystallization process 13 is the slower process. The amorphizationprocess 11 on the other hand is the faster process, which cannotactually be described by a sequence of quasi-static states. In thegraph, the amorphization 11 is illustrated by a dashed line.

FIG. 1 can illustrate the principle for an operating scenario of a phasechange memory. In the operating scenario, the temperature fluctuations 9are around 300° C. higher than those shown in the graph.

Specifically, the phase change between the crystalline phase 3 and theamorphous phase 5 in the phase change material is achieved bycoordinated heating and cooling within the context of an (advantageouslypulsed) switching current supply from a current signal. For theamorphization 11, the phase change material is firstly melted. By rapidcooling of the melt, the latter solidifies in the amorphous state 5. Onecondition for the amorphization 11 is that the cooling rate from themelting temperature to a glass temperature, which is usuallyapproximately ⅔ of the melting temperature, is greater than the coreforming and growth rate in the temperature range. The cooling rate fromthe glass temperature to room temperature does not play any role in theamorphization 11. The typical value of a critical cooling rate liesbetween 10⁹ to 10¹⁰° K/sec. Although the amorphous state 5 ismeta-stable, the stability period is more than 10 years at roomtemperature, which represents a stability period that is uncritical evenfor long-term storage.

The crystallization 13 of the amorphized material 5 to the crystallinestate 3 takes place by heating above the glass temperature, with themaximum temperature remaining below the melting temperature. In thistemperature range, the core forming and growth rate is at a maximum. Inthe present concept, within the context of an embodiment as explainedwith reference to FIGS. 3 and 4, a core forming zone is advantageouslyarranged such that it directly adjoins the memory material layer, sincein this way the core formation can be shortened and a switching timeduring crystallization can be shortened to 20 ns, whereas otherwiseswitching times in the region of 200 ns can be achieved.

The amorphization 11 and the crystallization 13 thus take place in eachcase at a suitably high temperature and with different dynamics. In theembodiment explained here, the phase transformations 11, 13 in a phasechange memory are used by three pulses for a read operation (Read), acrystallization 13 (Set) and an amorphization 11 (Reset).

For the Set operation, a relatively “long” switching current pulse isused, with typical pulse lengths in the region of 50 ns. As a result ofohmic losses, the temperature 9 in the switching zone rises above theglass temperature. The switching zone crystallizes for as long as thepulse is present.

For the Reset operation, the crystalline switching zone is heated abovethe melting temperature by means of a relatively “short” pulse, whereintypical pulse lengths are below 10 ns. Due to rapid cooling once thepulse is switched off, the melt solidifies to the amorphous state 5.

For the Read operation of the stored information items, a response, e.g.a voltage state, of the phase change memory/phase change memory cell toa weak current pulse is measured. The pulse length here depends only onthe integration time of the current measurement stage, and is in theregion of approximately 10 ns.

For further basic explanations concerning the physical mode of action ofa phase change memory, reference is made to the abovementioned article“Nonvolatile, High Density, High Performance Phase-Change Memory” byTyson, Wicker, Lowrey, Hudgens and Hunt in IEEE 2000, pages 385 to 390.

FIG. 2 shows the schematic structure of a phase change memory 21comprising a memory material layer 23 consisting of a phase changematerial, and a first electrical contact 25 and a second electricalcontact 27 which are located at a distance 29 from one another. Via thecontacts 25, 27, a switching zone 31 of the memory material layer 23 canbe traversed by a current signal. The current signal can be used tothermally induce, by means of a change in temperature 9, a phase change11, 13 (explained by way of example with reference to FIG. 1) between acrystalline phase 3 and an amorphous phase 5 and thus a change inresistance 7 of the phase change material in the switching zone 31.According to the present lateral concept and structure of the phasechange memory, the switching zone 31 is located along a lateralextension 33 of the phase change memory 21 between the first electricalcontact 25 and the second electrical contact 27, wherein currentconduction 35 of the current signal through the switching zone 31 takesplace along the lateral extension 33.

FIG. 3 shows a first preferred embodiment of a proposed phase changememory 41. View (a) shows in section the structure of the embodimentalong a vertical extension 43 of the phase change memory 41. View (b)shows the embodiment along a lateral extension 45 of the phase changememory 41. In the present case, the first electrical contact 47 islocated below the memory material layer 49 and the second electricalcontact 51 is located above the memory material layer 49. In thisembodiment of the phase change memory 41, the electrical contacts 47, 51are metallic. The active zone of the phase change memory 41 ispassivated 53 with silicon oxide (SiO₂). The memory material layer 49 inthis embodiment consists of a GeSbTe-based phase change material. Anitride layer 55 located therebelow assists the crystal core formationin order to allow faster and more reproducible switching of theswitching zone. A ZnS:SiO₂ layer 57 which in turn lies therebelow servesas an adjustable thermal barrier and electrical insulation with regardto the silicon heat sink 59, which in this embodiment is formed by ap-Si substrate. The switching zone 61 is located along a lateralextension 45 of the phase change memory 41 between the first electricalcontact 47 and the second electrical contact 51, wherein currentconduction 63 of the current signal through the switching zone 61 takesplace along the lateral extension 45. In particular, in this embodiment,the switching zone 61 is located at a narrowing 65 between the firstelectrical contact 47 and the second electrical contact 51 in the memorymaterial layer 49. The size 67 of the narrowing 65 is smaller than asize 69 of the memory material layer 49 at the first electrical contact47 or second electrical contact 51. The narrowing 65 is formed in thelateral extension in this example of embodiment.

FIG. 4 shows a second preferred embodiment 71 of the proposed phasechange memory, in which, unlike in FIG. 3, the first electrical contact73 and the second electrical contact 75 are located above the memorymaterial layer 49. In this embodiment 71, the switching zone 61 islocated in a region between and below the first electrical contact 73and the second electrical contact 75 along the lateral extension 45.Views (a) and (b) of FIG. 4 show a modified (compared to FIG. 3) currentconduction 77 of the current signal through the switching zone 61 alongthe lateral extension 45 of the phase change memory 71. Otherwise, thesame references as in FIG. 3 are used for elements of this embodimentwhich have the same function.

Both in FIG. 3 and in FIG. 4, the first electrical contact 73, 47 and/orthe second electrical contact 75, 51 directly adjoins the memorymaterial layer 49 and the switching zone 61 is formed in the memorymaterial layer 49 at a distance from the first electrical contact 73, 47and/or second electrical contact 75, 51. The thermal distance 79 of theswitching zone 61 from the electrical contacts 73, 47 and 75, 51 ispreferably between 20 nm and 50 nm.

In FIG. 3 and FIG. 4, in each case a narrowing 65 has been formed alongthe lateral extension 45. Moreover, a narrowing of the memory materiallayer 49 could also be effected along the vertical extension 43, whichis not shown in FIGS. 3 and 4 but will be explained with reference toFIG. 6.

In the lateral extension 45, the size of the structure is defined by theminimum feature size F, which with current technology in any case liesin a range from approximately 45 nm to 130 nm but with future technologywill lie much below 45 nm. In the vertical extension, the switching zonein the present lateral concept of a phase change memory 41, 71 can beprocessed to a thickness D from below 5 nm to an atomic layer thicknessof 0.5 nm. The traversing surface area, formed by the sizes F×Dperpendicularly to the lateral extension 45, for the current conduction63, 77 in the switching zone 61 is in the present lateral concept andstructure of a phase change memory 41, 71 much smaller than the smallestpossible traversing surface area defined by F² for the currentconduction in a phase change memory of conventional vertical structure.Depending on requirements, in the first and second preferred embodimentsof FIGS. 3 and 4 explained here, a ratio of the traversing surface areafor the current conduction 63, 77 in the switching zone 61 to atraversing surface area for the current conduction at the firstelectrical contact 47, 73 or second electrical contact 51, 75 can benarrowed, wherein the ratio of the traversing surface areas preferablylies between 1:2 and 1:100.

FIG. 5 shows a first, schematically shown processing sequence in threesteps (a), (b) and (c) for a further preferred embodiment of a proposedphase change memory 81. The top diagrams in each case show a plan viewalong the lateral extension 83. The bottom diagrams in each case show asectional view along the vertical extension 85. The starting materialfor this basic processing sequence is a silicon substrate 87, onto whicha layer system is deposited as a MESA structure 89 comprising theindividual layers in the lithography/deposition plane along the lateralextension 83. In this embodiment, the substrate 87 at the same timeserves as a heat sink. Firstly, an insulator as a heat conduction layer91 and insulation is applied to the substrate 87. In this embodiment,said insulator is a ZnS:SiO₂ layer, wherein the ratio of ZnS to SiO₂ is70:30. Thereafter, a phase change material is applied as a memorymaterial layer 93. In this embodiment, the phase change material is an[Sn]:GeSbTe-based material. Finally, a passivation layer 95, herecomposed of SiO₂, is applied. In step (b), a MESA structure is definedand structured via a suitable lithography and etching process. In step(c), contact windows are made in the passivation layer 95 via alithography and etching process, and are metallized with electricalcontacts 97 via a lift-off process.

FIG. 6 shows a second schematically shown processing sequence in fivesteps (a), (b), (c), (d) and (e) according to another preferredembodiment of the proposed phase change memory 101. This is once againformed by a MESA structure 103. The top diagrams in each case show aplan view along the lateral extension 83. The bottom diagrams in eachcase show a sectional view along the vertical extension 85.

The present preferred embodiment of the phase change memory 101 has theadvantage of a reduced bulk resistance and cell passivation. The reducedbulk resistance results in a lower operating voltage, and the cellpassivation prevents the inward diffusion of surrounding oxygen from theair. The starting point in the further preferred embodiment of FIG. 6 isa modified layer system (shown in diagram (a)) composed of a substrate105, a heat conduction layer 107, a memory material layer 109 and thenan electrically conductive layer 111 as the uppermost layer.

Via a suitable lithography and etching process (b), firstly a MESAstructure is defined and structured. A further lithography and etchingprocess (c) defines and structures a trench 113 in the region of theswitching zone. The trench 113 at one side divides the uppermostelectrically conductive layer 111, and thus defines a position for theelectrical contacts 115. At the other side, the thickness D of theswitching zone 119 is set by adjusting the etching depth 117. Thecurrent consumption of the phase change memory 101 is thus also set. Inthis further embodiment of the phase change memory 101 of FIG. 6, thethickness D of the memory material layer 109, as the size of a narrowingin the vertical extension 85, is thus smaller than a size 121 of thememory material layer 109 in the vertical extension 85 at the contactingarea, consisting of the electrical contacts 115 and the dividedelectrically conductive layer 111.

By means of a suitable deposition process (d), the existing layersequence is provided with a passivation 123. In a further step (e),contact windows are structured in the deposited passivation 123 by meansof a lithography and etching step, and in turn are metallized withelectrical contacts 115 by means of a lift-off process.

FIG. 7 shows a preferred embodiment of a phase change memory assembly131 which links together a first phase change memory 133, a second phasechange memory 135 and a third phase change memory 137. In each case oneof the electrical contacts 139, 141, 143 of each phase change memory133, 135, 137 is placed at the same electrical potential as a respectiveone of the electrical contacts 139, 141, 143 of the other phase changememories by leading all the electrical contacts 139, 141 and 143 to acommon pad 145 which is at ground 147. The respective other electricalcontacts 149, 151, 153 are assigned a switchable fixed potential via afurther associated pad 155, 157, 159 in each case.

This embodiment of a phase change memory assembly 131 is to beunderstood as merely one example of many embodiments of a phase changememory assembly which can be implemented depending on requirements.

According to the embodiments shown schematically in FIGS. 8 and 9, thebuild-up of a phase change memory cell from a phase change memory or aphase change memory assembly takes place within the context of a CMOSintegration of phase change memory cells in the lateral structure andconcept.

One particularly preferred embodiment of the integration of a phasechange memory 161 takes place, as shown in FIG. 8, via a firstelectrical contact 163 on a CMOS control transistor 165. Thecorresponding equivalent circuit diagram is shown on the right-hand sideof FIG. 8. The phase change memory cell 167 of FIG. 8 is processed on asilicon substrate 169 and is moreover provided with a passivation 171.The control transistor 165 defines in this embodiment a bit line BL viasource or drain, a word line WL via its gate, and a switching contact173 to the metallic contacting 163 via source or drain.

The phase change memory 161 is provided with a passivation 171 and in amemory material layer 179 has a switching zone 177 which is locatedbetween and at a distance from the first electrical contact 163 and thesecond electrical contact 175. In the embodiment of the phase changememory 161 which is shown in FIG. 8, a heat sink 181 is located as metallayer above the memory material layer 179, wherein the memory materiallayer 179 and the heat sink 181 are insulated from the memory materiallayer 179 via an insulation layer 183 for thermal and electricalinsulation. The heat sink 181, which is formed as a metallization overthe entire surface, also forms the ground terminal 185 in the presentembodiment of a phase change memory 161.

FIG. 9 shows a preferred embodiment of a phase change memory cell 187which has been modified compared to FIG. 8. Elements of the phase changememory cell 187 of FIG. 9 and of the phase change memory cell 167 ofFIG. 8 which have the same function have been provided with the samereferences. In the embodiment of the phase change memory cell 187,unlike in the embodiment of a phase change memory cell 167, it is not atransistor 165 which is connected upstream of the phase change memory162 as a selection unit with a non-linear current/voltage characteristicfor actuation purposes, but rather a diode 191. In this case, the upper,second electrical contact 175 can be used as the word line and thelower, first electrical contact 163 can be used as the bit line (or viceversa) directly for an X/Y addressing operation as explained withreference to FIGS. 10 and 11.

The diode 191 is furthermore integrated in the phase change memory 162.In the phase change memory cell 167 of FIG. 8, the transistor 165 asselection unit was connected externally upstream of the phase changememory 161. In the present case, in the phase change memory cell 187 ofFIG. 9, the diode 191 is located between the memory material layer 179and the first electrical contact 163 of the phase change memory 162.

In a modification of this embodiment, any selection unit could also belocated between the memory material layer 179 and the second electricalcontact 175.

The integration of a selection unit, in the present case a diode 191,has the advantage that this considerably simplifies the processing of aphase change memory cell 187 and moreover considerably increases theintegration density for a phase change memory cell 187 on account of thereduced space requirement.

For future memory concepts, the cost factor “bit per area ratio” willplay a dominant role. Thoughts of “stacking” the actual phase changememory cells above one another and thus forming three-dimensional 3Dphase change memory cell arrays are of great interest in thisconnection. In the present case, the lateral structure and the lateralconcept of a phase change memory as explained here offer a criticaladvantage for this type of integration compared to the verticalstructure of a conventional phase change memory.

The build-up of a 3D phase change memory cell array takes place with anumber of memory layers in the form of 2D phase change memory cellarrays which are arranged one above the other. A 2D phase change memorycell array 201 is shown in FIG. 10 in detail (a) and as an equivalentcircuit diagram (b). The 2D phase change memory cell array 201 comprisesa number of individually addressable phase change memory cells 203 whichare connected two-dimensionally within the context of row/column (x/y)addressing. Each of the phase change memory cells 203 is in the presentcase composed of a transistor 205 and a phase change memory 207. A diodeis preferably used instead of a transistor. A 3D phase change memorycell array 211 shown in FIG. 11 is shown in terms of itsthree-dimensional structure (a) and as an equivalent circuit diagram(b). It comprises a number of 2D phase change memory cell arrays 213which are arranged one above the other. In this case, respective phasechange memories 215 which are arranged directly above one another areactuated and contacted by a selection transistor 217 by way of a commonvia 219. In a phase change memory having a vertical structure, such anintegration is possible only to a limited extent and has to date notbeen implemented since a common via cannot be implemented or can beimplemented only with an additional space requirement. Rather, asdescribed in U.S. Pat. No. 6,525,953 B1, a conventional 3D phase changememory cell array relies on the separate contacting of each individualrow and column contact (correspondingly as a word line or bit line orvice versa) in all memory layers.

By contrast, in the present embodiment of a 3D phase change memory cellarray 211 of FIG. 11, the switching of phase change memories 215arranged directly above one another to a first fixed potential takesplace by way of the common via 219. The row/column (x/y) addressing forthe planes takes place in this way. All the phase change memories 215lying one above the other along a Z-direction are thus at the fixedfirst potential defined by the via 219. The Z-addressing, for examplethe selection of the bottom phase change memory cell 215 in theembodiment 211 of FIG. 11, in this embodiment takes place by placing allthe other phase change memory cells of the other 2D phase change memorycell arrays at a second, free potential, e.g. ground potential 221.

FIG. 12 shows an electronic component 225 (embedded device, e.g. ASICS)which combines an integrated memory function 227 and/or logic function223. Here, the integrated memory function 227 and/or logic function 223comprises a phase change memory, a phase change memory cell assembly, aphase change memory cell or a phase change memory cell array of theabove-described type.

To summarize, the current flow limitation for switching a phase changememory (PC-RAM) represents a significant problem in phase changememories of the known type. All the previous concepts for implementing aphase change memory are based on vertical current conduction, whichtakes place perpendicularly to the lateral extension of the phase changememory between two electrical contacts lying above one another. Knownphase change memories are thus designed for current conduction verticalto the lithography/deposition plane.

Particularly efficient current limitation is achieved in a phase changememory 21, 41, 71, 81, 101, 161, 162, 215 comprising a memory materiallayer 23, 49, 93, 109, 179 consisting of a phase change material, and afirst 25, 47, 73, 97, 115 and second 27, 51, 75, 97, 115 electricalcontact which are located at a distance from one another and via which aswitching zone 31, 61, 119, 177 of the memory material layer 23, 49, 93,109, 179 can be traversed by a current signal, wherein the currentsignal can be used to induce a phase change 11, 13 between a crystallinephase 3 and an amorphous phase 5 and thus a change in resistance 7 ofthe phase change material in the switching zone 31, 61, 119, 177. Insuch a phase change memory, it is provided within the context of thenovel concept that the switching zone 31, 61, 119, 177 is located alonga lateral extension 33, 45, 83 of the phase change memory between thefirst 25, 47, 73, 97, 115 and second 27, 51, 75, 97, 115 electricalcontacts, wherein current conduction 35, 63, 77 of the current signalthrough the switching zone 31, 61, 119, 177 takes place along thelateral extension 33, 45, 83. Inter alia, a traversing surface area,formed perpendicularly to the lateral extension, for the currentconduction 35, 63, 77 can be considerably reduced in this way, so thatthe switching current required for a current signal is considerablyreduced.

The novel concept also relates to a phase change memory assembly 131, aphase change memory cell 167, 187, 203, a 2D phase change memory cellarray 201, 213, a 3D phase change memory cell array 211 and anelectronic component 225.

LIST OF REFERENCES

-   1 resistance/temperature graph-   3 crystalline phase-   5 amorphous phase-   7 change in resistance-   9 change in temperature-   11 amorphization-   13 crystallization-   21 phase change memory-   23 memory material layer-   25 first electrical contact-   27 second electrical contact-   29 distance-   31 switching zone-   33 lateral extension-   35 current conduction-   41 first preferred embodiment of a phase change memory-   43 vertical extension-   45 lateral extension-   47 first electrical contact-   49 memory material layer-   51 second electrical contact-   53 passivation-   55 core forming zone-   57 ZnS:SiO₂ layer-   59 silicon heat sink-   61 switching zone-   63 current conduction-   65 narrowing-   67 size-   69 size-   71 second preferred embodiment of a phase change memory-   73 first electrical contact-   75 second electrical contact-   77 modified current conduction-   79 thermal distance-   81 further preferred embodiment of a phase change memory-   phase change memory-   83 lateral extension-   85 vertical extension-   87 silicon substrate-   89 MESA structure-   91 heat conduction layer-   93 memory material layer-   93 passivation layer-   97 electrical contacts-   101 phase change memory-   103 MESA structure-   105 substrate-   107 heat conduction layer-   119 memory material layer-   111 electrically conductive layer-   113 trench-   115 electrical contacts-   117 etching depth-   119 switching zone-   123 passivation-   131 phase change memory assembly-   133 first phase change memory-   135 second phase change memory-   137 third phase change memory-   139, 141, 143 electrical contact-   145 pad-   147 ground-   149, 151, 153 electrical contact-   155, 157, 159 pad-   161 phase change memory-   162 phase change memory-   163 first electrical contact-   165 CMOS control transistor-   167 phase change memory cell-   169 silicon substrate-   171 passivation-   173 switching contact-   175 second electrical contact-   177 switching zone-   179 memory material layer-   181 heat sink-   183 insulation layer-   185 ground terminal-   187 phase change memory cell-   191 diode-   201 2D phase change memory cell array-   203 addressable phase change memory cells-   205 transistor-   207 phase change memory-   211 3D phase change memory cell array-   213 2D phase change memory cell array-   215 phase change memory-   217 selection transistor-   219 via-   221 ground potential-   223 memory function and/or logic function-   225 electronic component-   227 application-specific component (embedded device)-   D thickness

1-18. (canceled)
 19. A phase change memory comprising: a phase changememory material layer having a lateral extension; and first and secondelectrical contacts configured to define a lateral switching zone in thememory material layer between the first and second electrical contactswherein the lateral switching zone can be traversed by a current signalthat can be used to induce a reversible phase change in the phase changememory material layer between a crystalline phase and an amorphous phaseand thus a change in resistance of the phase change material in thelateral switching zone.
 20. The phase change memory according to claim19 wherein current conduction of the current signal through theswitching zone takes place along the lateral extension.
 21. The phasechange memory according to claim 20 wherein the lateral switching zoneis located at a narrowing in the memory material layer between the firstand second electrical contacts and the size of the narrowing is lessthan the memory material layer size at the first or second electricalcontacts.
 22. The phase change memory according to claim 21 furthercomprising a traversing surface area formed perpendicularly to thelateral extension for current conduction in the lateral switching zoneand is narrowed in relation to a traversing surface area for currentconduction at the first or second electrical contacts, wherein the ratiobetween the lateral switching zone traversing area and contacttraversing areas is in a range of between 1:2 and 1:100.
 23. The phasechange memory according to claim 22 wherein a vertical extension size(D) of the lateral switching zone narrowing is less than the memorymaterial layer vertical extension size at the first or second electricalcontact.
 24. The phase change memory according to claim 23 wherein thefirst and second electrical contacts adjoin the memory material layerand the switching zone is formed in the memory material layer at adistance from the first and/or second contact.
 25. The phase changememory according to claim 24 wherein the distance between the first andsecond electrical contact is oriented along the lateral extension andthe first electrical contact is located below the memory material layerand the second electrical contact is located above the memory materiallayer.
 26. The phase change memory according to claim 24 wherein thedistance between the first and second electrical contact is orientedalong the lateral extension, wherein the first and the second electricalcontacts are located above the memory material layer.
 27. The phasechange memory according to claim 25 wherein the lateral switching zoneis located between the first and second electrical contacts and abovethe first and below the second electrical contact along the lateralextension.
 28. The phase change memory according to claim 27 furthercomprising a core forming zone adjoining the memory material layer. 29.The phase change memory according to claim 28 wherein the first andsecond electrical contacts and the memory material layer form part of amesa which is applied to a substrate, wherein the memory material layeris insulated from a heat sink by a thermal barrier.
 30. The phase changememory according to claim 26 wherein the lateral switching zone islocated between the first and second electrical contacts and below thefirst and second electrical contact along the lateral extension.
 31. Thephase change memory according to claim 30 further comprising a coreforming zone adjoining the memory material layer.
 32. The phase changememory according to claim 31 wherein the first and second electricalcontacts and the memory material layer form part of a mesa which isapplied to a substrate, wherein the memory material layer is insulatedfrom a heat sink by a thermal barrier.
 33. A phase change memory cellcomprising: a plurality of phase change memories, wherein each phasechange memory comprises: a phase change memory material layer having alateral extension; and first and second electrical contacts configuredto define a lateral switching zone in the memory material layer betweenthe first and second electrical contacts wherein the lateral switchingzone can be traversed by a current signal that can be used to induce areversible phase change in the phase change memory material layerbetween a crystalline phase and an amorphous phase and thus a change inresistance of the phase change material in the lateral switching zone;and in each phase change memory cell, one of the electrical contacts ofeach phase change memory is at the same electrical potential as arespective one of the electrical contacts of the other phase changememories.
 34. The phase change memory cell according to claim 33 furthercomprising a selection unit with a non-linear current/voltagecharacteristic.
 35. The phase change memory cell according to claim 34wherein the selection unit is integrated in the phase change memoryand/or the phase change memory cell.
 36. The phase change memory cellaccording to claim 34 wherein the selection unit is located in the phasechange memory between the memory material layer and the first electricalcontact and/or between the memory material layer and the secondelectrical contact.
 37. A 2-dimensional phase change memory cell arraycomprising a plurality of two-dimensionally connected and individuallyaddressable phase change memory cells wherein each memory cellcomprises: a plurality of phase change memories, wherein each phasechange memory comprises: a phase change memory material layer having alateral extension; and first and second electrical contacts configuredto define a lateral switching zone in the memory material layer betweenthe first and second electrical contacts wherein the lateral switchingzone can be traversed by a current signal that can be used to induce areversible phase change in the phase change memory material layerbetween a crystalline phase and an amorphous phase and thus a change inresistance of the phase change material in the lateral switching zone;and in each phase change memory, one of the electrical contacts of eachphase change memory is at the same electrical potential as a respectiveone of the electrical contacts of the other phase change memories.
 38. A3D phase change memory cell array comprising: a plurality oftwo-dimensionally connected and individually addressable phase changememory cell arrays wherein each memory cell array comprises: a pluralityof phase change memories, wherein each phase change memory comprises: aphase change memory material layer having a lateral extension; and firstand second electrical contacts configured to define a lateral switchingzone in the memory material layer between the first and secondelectrical contacts wherein the lateral switching zone can be traversedby a current signal that can be used to induce a reversible phase changein the phase change memory material layer between a crystalline phaseand an amorphous phase and thus a change in resistance of the phasechange material in the lateral switching zone; and in each phase changememory, one of the electrical contacts of each phase change memory is atthe same electrical potential as a respective one of the electricalcontacts of the other phase change memories; and arranged one above theother, wherein respective phase change memories which are arrangeddirectly above one another are contacted by way of a common via.
 39. The3D phase change memory cell array according to claim 38 furthercomprising: in order to address a selected phase change memory of a 2Dphase change memory cell array, respective phase change memories whichare arranged directly above one another can be switched to a firstpotential by way of the common via, and in the process all the otherphase change memory cells of any other 2D phase change memory cell arraycan be switched to a second potential.
 40. An electronic component withan application specific module and an integrated memory function and/orlogic function, comprising: a phase change memory comprising: a phasechange memory material layer having a lateral extension; and first andsecond electrical contacts configured to define a lateral switching zonein the memory material layer between the first and second electricalcontacts wherein the lateral switching zone can be traversed by acurrent signal that can be used to induce a reversible phase change inthe phase change memory material layer between a crystalline phase andan amorphous phase and thus a change in resistance of the phase changematerial in the lateral switching zone.
 41. The electronic componentaccording to claim 40 further comprising a phase change memory cellwherein the phase change memory cell comprises: a plurality of phasechange memories; and in each phase change memory cell, one of theelectrical contacts of each phase change memory is at the sameelectrical potential as a respective one of the electrical contacts ofthe other phase change memories.
 42. The electronic component accordingto claim 41 further comprising a plurality of two-dimensionallyconnected and individually addressable phase change memory cell arrayswherein each memory cell array comprises a plurality of phase changememory cells arranged one above the other, wherein respective phasechange memories which are arranged directly above one another arecontacted by way of a common via.